Gembird TG-G1.5-01 heat sink compound 4.5 W/m·K 1.5 g

SKU
TG-G1.5-01
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In stock
Heatsink thermal paste grease, 1.5 g weight
- Thermal compund (grease) for heatsinks
- Helps the heat dissipation from a CPU, chipset or processor to a heatsink
- Excellent thermal impedance
- Perfect stability - will not separate, run, migrate, or bleed
- Non capacitive or electrically conductive
EAN 8716309083126
Specification
Features
Thermal resistance0.205 °C/W
Viscosity note76 CPS
Thermal conductivity4.5 W/m·K
Operating temperature (T-T)-50 - 240 °C
Product colourGrey
Technical details
Compliance certificatesRoHS
Thermal resistance0.205 °C/W
Viscosity note76 CPS
Thermal conductivity4.5 W/m·K
Operating temperature (T-T)-50 - 240 °C
Weight & dimensions
Width50 mm
Depth80 mm
Height15 mm
Weight1.5 g
Package width325 mm
Package depth335 mm
Package height175 mm
Package weight2.1 kg
Packaging data
Package width325 mm
Package depth335 mm
Package height175 mm
Package weight2.1 kg
Operational conditions
Operating temperature (T-T)-50 - 240 °C
Colour
Product colourGrey
Manufacturer Gembird
In Stock Y
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