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Gembird TG-G3.0-01 heat sink compound 4.5 W/m·K 3 g
SKU
TG-G3.0-01
Category: Heat Sink Compounds
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- Thermal compund (grease) for heatsinks
- Helps the heat dissipation from a CPU, chipset or processor to a heatsink
- Excellent thermal impedance
- Perfect stability - will not separate, run, migrate, or bleed
- Non capacitive or electrically conductive
- Helps the heat dissipation from a CPU, chipset or processor to a heatsink
- Excellent thermal impedance
- Perfect stability - will not separate, run, migrate, or bleed
- Non capacitive or electrically conductive
| EAN | 8716309083133 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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| Specification |
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| Manufacturer | Gembird | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| In Stock | Y | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||