DELL OptiPlex 7010 Intel® Core™ i7 i7-13700 16 GB DDR5-SDRAM 512 GB SSD Windows 11 Pro SFF PC Black

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X1X4X
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DELL OptiPlex 7010, Intel® Core™ i7, i7-13700, 16 GB, 512 GB, Windows 11 Pro, 64-bit
DELL OptiPlex 7010. Processor family: Intel® Core™ i7, Processor model: i7-13700. Internal memory: 16 GB, Internal memory type: DDR5-SDRAM, Memory clock speed: 4400 MHz. Total storage capacity: 512 GB, Storage media: SSD. On-board graphics card model: Intel UHD Graphics 770. Operating system installed: Windows 11 Pro, Operating system architecture: 64-bit. Power supply: 260 W. Chassis type: SFF. Product type: PC. Product colour: Black
EAN 5397184800447
Specification
Processor
Processor generation13th gen Intel® Core™ i7
Bus typeDMI4
Processor cache typeSmart Cache
Processor cache30 MB
Processor modeli7-13700
Number of processors installed1
Processor manufacturerIntel
Processor boost frequency5.2 GHz
Processor threads24
Processor cores16
Processor familyIntel® Core™ i7
Performance cores8
Efficient cores8
Performance-core base frequency2.1 GHz
Efficient-core base frequency1.5 GHz
Processor base power65 W
Maximum turbo power219 W
Efficient-core Max Turbo Frequency4.1 GHz
Performance-core Max Turbo Frequency5.1 GHz
Memory
Memory layout (slots x size)2 x 8 GB
Internal memory16 GB
Maximum internal memory128 GB
Memory slots4x DIMM
Internal memory typeDDR5-SDRAM
Memory clock speed4400 MHz
Storage
Storage mediaSSD
Optical drive typeNo
SSD interfacePCI Express
SSD capacity512 GB
Number of SSDs installed1
Total storage capacity512 GB
SSD form factorM.2
Total SSDs capacity512 GB
SSD performance class35
NVMeYes
Graphics
Discrete graphics cardNo
On-board graphics card familyIntel® UHD Graphics
On-board graphics cardYes
Discrete graphics card modelNot available
On-board graphics card modelIntel UHD Graphics 770
On-board GPU manufacturerIntel
Optical drive
Optical drive typeNo
Network
Ethernet LANYes
Wi-FiNo
Ethernet LAN data rates10,100,1000 Mbit/s
Cabling technology10/100/1000Base-T(X)
Ports & interfaces
Combo headphone/mic portYes
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity3
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity2
Number of SATA III connectors3
USB 2.0 ports quantity4
Line-outYes
Line-inYes
Ethernet LAN (RJ-45) ports1
DisplayPorts quantity3
PowerShareYes
Number of USB ports with PowerShare support1
DisplayPort version1.4a
USB 3.2 Gen 2x2 Type-C ports quantity1
Expansion slots
PCI Express x4 (Gen 3.x) slots1
PCI Express x16 (Gen 4.x) slots1
Technical details
Cable lock slot typeKensington
Product typePC
Trusted Platform Module (TPM)Yes
Product colourBlack
Chassis typeSFF
Audio systemHigh Definition Audio
Placement supportedHorizontal/Vertical
Cable lock slotYes
Motherboard chipsetIntel Q670
Design
Cable lock slot typeKensington
Product colourBlack
Chassis typeSFF
Placement supportedHorizontal/Vertical
Cable lock slotYes
Intel® vPro™ Platform EligibilityYes
Performance
Audio chipRealtek ALC3246-CG
Product typePC
Trusted Platform Module (TPM)Yes
Audio systemHigh Definition Audio
Motherboard chipsetIntel Q670
Software
Operating system languageCzech, English, Hungarian, Polish, Slovak
Operating system architecture64-bit
Trial softwareNo Microsoft Office License Included 30 day Trial Offer Only
Operating system installedWindows 11 Pro
Processor special features
CPU configuration (max)1
Intel® vPro™ Platform EligibilityYes
Power
Power supply input frequency47/63 Hz
Power supply input voltage90 - 264 V
Power supply260 W
Operational conditions
Operating altitude-15.2 - 3048 m
Storage temperature (T-T)-40 - 65 °C
Operating relative humidity (H-H)20 - 80%
Storage relative humidity (H-H)5 - 95%
Operating temperature (T-T)10 - 35 °C
Non-operating altitude-15.2 - 10668 m
Operating vibration0.26 G
Non-operating vibration1.37 G
Non-operating shock105 G
Sustainability
Total carbon footprint350 kg of CO2e
Weight & dimensions
Width92.6 mm
Depth292.8 mm
Height290 mm
Packaging content
Cables includedAC
Display includedNo
Mouse included on selected markets onlyYes
Keyboard included on selected markets onlyYes
Mouse connectivityWired
Keyboard connectivityWired
Carbon footprint
Total carbon footprint350 kg of CO2e
Total carbon emissions (w/o Use phase)248 kg of CO2e
Total carbon emissions (Standard deviation)89 kg of CO2e
PAIA version1.3.2
Carbon emissions (Use)102 kg of CO2e
Carbon emissions (Manufacturing)229 kg of CO2e
Carbon emissions (Logistics)15 kg of CO2e
Carbon emissions (End-of-Life)4 kg of CO2e
Other features
Trusted Platform Module (TPM)Yes
On-board graphics cardYes
Processor manufacturerIntel
Manufacturer DELL
In Stock Y
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