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Thermaltake TG-60 heat sink compound Thermal paste 52 W/m·K 1 g
SKU
CL-O034-GROSGM-A
Category: Heat Sink Compounds
Self service 24/7
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TG-60 Liquid Metal Compound is Thermaltake’s first liquid metal compound with high thermal conductivity of
52 W/m-k, and can be applied on copper or nickel-plated materials with excellent cooling performance.
High Thermal Conductivity
With a thermal conductivity of 52 W/m-k, the TG-60 liquid metal compound shows a high heat transfer rate better than other thermal compounds, ensuring the best cooling performance.
Even Better Cooling Performance
We’ve also tested TG-60 within our Thermal Chamber running Full Load for 30 minutes on each model under 25。 C ambient temperature and 50% humidity. Overclocking 4.8 GHz, we can see that compared to regular thermal compounds, TG-60 shows outstanding cooling performance and can perform even better than liquid metals from other brands.
All-In-One Application Kit
TG-60 Liquid Metal Compound has an application kit, which includes a set of tools for immediate use.
52 W/m-k, and can be applied on copper or nickel-plated materials with excellent cooling performance.
High Thermal Conductivity
With a thermal conductivity of 52 W/m-k, the TG-60 liquid metal compound shows a high heat transfer rate better than other thermal compounds, ensuring the best cooling performance.
Even Better Cooling Performance
We’ve also tested TG-60 within our Thermal Chamber running Full Load for 30 minutes on each model under 25。 C ambient temperature and 50% humidity. Overclocking 4.8 GHz, we can see that compared to regular thermal compounds, TG-60 shows outstanding cooling performance and can perform even better than liquid metals from other brands.
All-In-One Application Kit
TG-60 Liquid Metal Compound has an application kit, which includes a set of tools for immediate use.
| EAN | 4713227531276 | ||||||||||||||||||||||||||||
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| Manufacturer | Thermaltake | ||||||||||||||||||||||||||||
| In Stock | Y | ||||||||||||||||||||||||||||