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Gembird TG-P-01 heat sink compound Thermal pad 2 W/m·K 23 g
SKU
TG-P-01
Category: Heat Sink Compounds
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Thermal silicone pad for heatsinks
Helps the heat dissipation from a CPU, chipset or processor to a heatsink
Excellent thermal impedance
Perfect stability - will not separate, run, migrate, or bleed
Non capacitive or electrically conductive
Helps the heat dissipation from a CPU, chipset or processor to a heatsink
Excellent thermal impedance
Perfect stability - will not separate, run, migrate, or bleed
Non capacitive or electrically conductive
| EAN | 8716309102704 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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| Specification |
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| Manufacturer | Gembird | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| In Stock | Y | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||